TAC-130 Spec 06 has high thermal conductivity and high flexibility. It consists of special surface coating and carbon powder in nano size to ensure high thermal […]
Thermal Conductivity of 10 W/mc ROHS Halogen free FOr high Thermal performance demands http://schlegelemi.com/upload/files/Update_TDS_Oct.2017/TDS_OP_9700Rev01.pdf
MuShield has developed an extrusion process to bring seamless mumetal tubing to the magnetic shielding market. A mumetal seamless tube can offer magnetic shielding advantages over […]
For 25 years MuShield and Silram have worked together to expand both of our operative business missions. MuShield has loyally supplied Silram with magnetic shielding components […]
Using our background of over 25 years in display enhancement and other display bonding options Optical Filters has developed Viz-Bond™, a wet bonding system that cures […]
Flared Characteristics Widely spaced pin arrays and large surface areas A combination not attainable by traditional heat sinks Incoming air streams are able to enter and […]
Thermal grease is used with dispensing equipment and screen printing applications for high volume production. Typical Applications Include: • Heat source to heat spreader/heat sink. • […]
Thermal gap pads are most commonly used to bridge components to a heat sink or chassis. Typical Applications Include: • Mass storage devices • Telecommunications hardware […]
DynaGreen™ / DynaShear Gaskets Schlegel Electronic Materials introduces DynaGreen™ / DynaShear: an innovative EMI shielding gasket family for the shielding of modules in card/cages environment that […]
Schlegel Electronic Materials (SEM), a well-respected leader in the EMI Shielding industry, introduces Fabric over Silicone EMI Gaskets (FoS) for high temperature applications. FoS has been […]
Development of our conductive elastomer process now enables us to offer automated jointing of miniature conductive elastomer Orings, including hollow sections as small as 12.00mm ID. […]
Developed to address the dual requirements of environmental sealing and high levels of shielding. Eliminates the potential for galvanic corrosion associated with highly conductive materials when […]
Overview UltraCool III Forged out of pure aluminum, UltraCool III pin fin heat sinks provide outstanding cooling solutions for SM devices. · UltraCool III heat sinks […]
Developed to address the dual requirements of environmental sealing and high levels of shielding. Eliminates the potential for galvanic corrosion associated with highly conductive materials when […]
“Electromagnetic shielding is the practice of reducing the electromagnetic field in a space by blocking the field with barriers made of conductive or magnetic materials. Shielding […]
TIM (Thermal Interface Materials) The continuously increasing technical demands, placed by the electronic industry on electronic and electrical devices, such as higher frequencies, component miniaturization, more […]